Ammunition & Hand Loading > Cartridge and Shotshell reloading
Copper Plating
GreyGeek:
--- Quote from: DangerousDrummer on April 03, 2013, 07:47:18 PM ---Here is where I got it.
www.eimodule.com
--- End quote ---
This one?
http://www.eimodule.com/index.php?main_page=product_info&cPath=3&products_id=62
DangerousDrummer:
Found it! Polyethylene Glycol, is a plating leveler. Available at Walmart as a laxative for about $6. There is something else called Janus Green B which will require more research. Found these references in an engineering student paper at a university.
DangerousDrummer:
No, this one
http://www.eimodule.com/index.php?main_page=product_info&cPath=3&products_id=39
DangerousDrummer:
Janus Green B is an organic dye commonly used to stain mitochondrial cells. I knew I had heard of it but didn't know where. Biology class was a long time ago!
DangerousDrummer:
So Polyethylene Glycol and Janus Green B are inhibitors which slow the process, this makes sense when we know that slow is also acheived by low voltage and low amperage. Hydrochloric acid is an accelerant! I am not sure that we want any accelerants. The paper on bullet plating on Caswell said the bullets were platd 24 hours, which in my thinking is very slooooow. Sulfuric acid is an organic acid and is the carrier, and vinegar is also an organic acid. I think this explains it pretty well.
"The absolute minimum formula for a Copper plating bath is a Copper Sulfate solution with some Sulfuric acid. In addition to this, one can add inhibitors and levelers such as Polyethylene Glycol (PEG), Janus Green B, or a brightener. Each of these slows the rate of plating at peaks on the surface of the Copper, leading to a smoother plated surface. The other type of additive is an accelerant, which helps the throwing power of the solution and increases the rate of plating. Hydrochloric acid is the only accelerant that has been tested."
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